Providing Solutions for Defense and Aerospace Industries
Producing high reliability, advanced technology at the highest performance levels with zero tolerance for equipment failures. AdvancedPCB stands behind its product.
Manufacturing Capabilities
- Technology Expertise from Standard to Advanced, from Rigid to Flex & Rigid Flex
- Cycle Times that are World Class
- Engineering Support complete and detailed
- Offshore Manufacturing partners offering cost-effective solutions
USA Made to Meet the Most Rigorous Standards
Performance Standards for Printed Circuit Board Manufacturing for Defense & Aerospace and Commercial Markets
Information Used to Guide Future Decisions
$715B | 33% | 5-15 Years |
---|---|---|
Department of Defense Releases Latest Budget Proposal for Fiscal Year AdvancedPCB has been providing product to Defense & Aerospace companies, which call for very stringent certs | The percentage of Defense Department expenditure in electronics Future budgets of the DOD look to invest in Unmanned Vehicles; Artificial Intelligence; & Hypersonic Weapons | The average electronic product lifespan for applications in the DOD This is two to three times that of commercial products. Reliability and Integrity are hallmarks at AdvancedPCB |
Corporate Manufacturing Capabilities
ATTRIBUTES | STANDARD | ADVANCED | DEVELOPMENT (NPI ONLY) |
---|---|---|---|
Panel Sizes | 12 x 18, 18 x 24, 21 x 24 | 20 x 26 | 21 x 27 |
Layer Counts | 2 – 28 | 30 – 42 | 44 + |
Flex Layer Counts | 2 – 6 | 8 – 10 | 12 + |
Rigid Flex Layer Counts | 4 – 14 | 16 – 24 | 26 + |
Cavity Sizes | 1.0″ x 1.0″ | .750″ x .750″ | < .500″ x .500″ |
LAMINATES – MATERIALS | STANDARD | ADVANCED | DEVELOPMENT (NPI ONLY) |
---|---|---|---|
Pb Free RoHs – 170+ Tg FR4 | Yes | Yes | Yes |
Med Loss – FR408HR,MEG 4, -13EP | Yes | Yes | Yes |
Low Loss – MEG 6, I-Speed, IteraMT40 | Yes | Yes | Yes |
Ultra Low Loss – Tachyon100G, EM890K, MEG 7 | Yes | Yes | Yes |
Polyimide | Yes | Yes | Yes |
Rogers Laminates | Yes | Yes | Yes |
Flex – Dupont AP | Yes | Yes | Yes |
Flex – Dupont LF | Yes | Yes | Yes |
Flex – Dupont FR | Yes | Yes | Yes |
Halogen Free | Yes | Yes | Yes |
IMAGED TRACE / SPACE / PAD | STANDARD | ADVANCED | DEVELOPMENT (NPI ONLY) |
---|---|---|---|
Internal Line Width | .003″ | .002″ | .0015″ |
Internal Spacing | .003″ | .002″ | .0015″ |
External Line Width | .003″ | .002″ | .0015″ |
External Spacing | .003″ | .002″ | .0015″ |
Minimum Pad | .015″ | .008″ | .006″ |
Impedance Tolerance | 10% | 5% | <5% |
SMT Pitch | .010″ | .008″ | .006″ |
VIA – PTH TOLERANCES | STANDARD | ADVANCED | DEVELOPMENT (NPI ONLY) |
---|---|---|---|
Smallest Drilled Via | .0079″ | .005″ | .004″ |
Aspect Ratio | 10:1 | 16:1 | 20:1 |
Minimum Cu Clearance to Hole | .008″ | .006″ | .0045″ |
PTH Tolerance [+/-] | .003″ | .002″ | .0015″ |
NPTH Tolerance | .001″ | .001″ | .001″ |
Back Drill Depth Tolerance | .005″ | .003″ | .002″ |
HDI CAPABILITIES | STANDARD | ADVANCED | DEVELOPMENT (NPI ONLY) |
---|---|---|---|
Sequential Lamination | 3x Lam Cycles | 7x Lam Cycles | 8x Lam Cycles |
Laser Micro Vias | .004″ | .003″ | .0025″ |
Blind Aspect Ratio | .75:1 | 1:1 | 1.2:1 |
Blind/Buried Vias | .005″ | .004″ | .003″ |
Via in Pad | Epoxy or Copper Filled | – | – |
Laser Routing Board Thickness | <.040″ | .040″ – .062″ | .062″ + |
SOLDER MASK-NOMENCLATURE | STANDARD | ADVANCED | DEVELOPMENT (NPI ONLY) |
---|---|---|---|
LPI Soldermask | Green, Blue, Red, Clear | Black, White, Purple | All Colors |
Minimum Clearance | .002″ | .001″ | .0005″ |
Minimum Web | .004″ | .003″ | .002″ |
Legend Color | White | Black, Yellow, Orange | All Colors |
TEST & MEASUREMENT | STANDARD | ADVANCED | DEVELOPMENT (NPI ONLY) |
---|---|---|---|
Flying Probe Test | Yes | Yes | Yes |
Fixture Test | Yes | Yes | Yes |
TDR | Yes | Yes | Yes |
Ionics | Yes | Yes | Yes |
CMI XRF | Yes | Yes | Yes |
D Coupon | Yes | Yes | Yes |
IST | Yes | Yes | Yes |
HI-POT | Yes | Yes | Yes |
DOWNLOAD CORPORATE MANUFACTURING CAPABILITIES
Our Capabilities
ATTRIBUTES | STANDARD | ADVANCED | DEVELOPMENT (NPI ONLY) |
---|---|---|---|
Panel Sizes | 12 x 18, 18 x 24, 21 x 24 | 20 x 26 | 21 x 27 |
Rigid Layer Counts | 2 – 28 | 30 – 38 | 40 + |
Flex Layer Counts | 2 – 6 | 8 – 10 | 12 + |
Rigid Flex Layer Counts | 4 – 14 | 16 – 24 | 26 + |
TRACE / SPACE / PAD | STANDARD | ADVANCED | DEVELOPMENT (NPI ONLY) |
---|---|---|---|
Internal Trace & Space | .003″ | .002″ | .0015″ |
External Trace & Space | .003″ | .002″ | .0015″ |
Minimum Via Pad | .015″ | .010″ | .008″ |
Impedance Tolerance | +/-10% | +/-5% | +/- <5% |
VIA – PTH TOLERANCES | STANDARD | ADVANCED | DEVELOPMENT (NPI ONLY) |
---|---|---|---|
Aspect Ratios | 10:1 | 14:1 | 18:1 |
Minimum Cu Clearance to Hole | .008″ | .006″ | .004″ |
HDI CAPABILITIES | STANDARD | ADVANCED | DEVELOPMENT (NPI ONLY) |
---|---|---|---|
Sequential Lamination | 3x Lam Cycles | 5x Lam Cycles | 7x Lam Cycles |
STANDARD - what we manufacture routinely
ADVANCED - may require special process attention or additional quality control steps
DEVELOPMENT (NPI ONLY) - requires intimate engineering analysis