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Providing Solutions for Telecommunications & Mobility Industries

    Producing high reliability, advanced technology at the highest performance levels with zero tolerance for equipment failures. AdvancedPCB stands behind its product.

    Information Used to Guide Future Decisions

    $580.7B3 Years5 Billion

    Latest revenue estimation for Telecommunications Industry

    All AdvancedPCB factories are equipped with the latest resources to support the telecommunication industry growth.

    Estimated lifespan for an average communications product

    The AdvancedPCB business model calls for World-Class quick turn capability to support new product introductions.

    Estimated number of people owning a mobile device

    Knowledgeable people given the latest equipment & systems to stay ahead of the mobile device curve.

    AdvancedPCB offers a combination of a Broad Range of Technologies, with World-Class Lead Times in supporting the Telecommunications & Mobility Industry.



    A partner that not only offers technology solutions but delivers quicker than the competition is invaluable.







    The 4 Reasons to Choose AdvancedPCB

    • Technology Expertise from Standard to Advanced, from Rigid to Flex & Rigid Flex
    • Cycle Times that are World Class
    • Engineering Support complete and detailed
    • Offshore Manufacturing partners offering cost-effective solutions


    Corporate Manufacturing Capabilities

    ATTRIBUTESSTANDARDADVANCEDDEVELOPMENT (NPI ONLY)
    Panel Sizes12 x 18, 18 x 24, 21 x 2420 x 2621 x 27
    Layer Counts2 – 2830 – 4244 +
    Flex Layer Counts2 – 68 – 1012 +
    Rigid Flex Layer Counts4 – 1416 – 2426 +
    Cavity Sizes1.0″ x 1.0″.750″ x .750″< .500″ x .500″


    LAMINATES – MATERIALS
    		STANDARD
    		ADVANCED
    		DEVELOPMENT (NPI ONLY)
    Pb Free RoHs – 170+ Tg FR4YesYesYes
    Med Loss – FR408HR,MEG 4, -13EP YesYesYes
    Low Loss – MEG 6, I-Speed,
    IteraMT40     		YesYesYes
    Ultra Low Loss – Tachyon100G,
    EM890K, MEG 7     		YesYesYes
    PolyimideYesYesYes
    Rogers LaminatesYesYesYes
    Flex – Dupont APYesYesYes
    Flex – Dupont LFYesYesYes
    Flex – Dupont FRYesYesYes
    Halogen FreeYesYesYes


    IMAGED TRACE / SPACE / PAD
    		STANDARD
    		ADVANCED
    		DEVELOPMENT (NPI ONLY)
    Internal Line Width.003″.002″.0015″
    Internal Spacing.003″.002″.0015″
    External Line Width.003″.002″.0015″
    External Spacing.003″.002″.0015″
    Minimum Pad.015″.008″.006″
    Impedance Tolerance10%5%<5%
    SMT Pitch.010″.008″.006″


    VIA – PTH TOLERANCES
    		STANDARD
    		ADVANCED
    		DEVELOPMENT (NPI ONLY)
    Smallest Drilled Via.0079″.005″.004″
    Aspect Ratio10:116:120:1
    Minimum Cu Clearance to Hole.008″.006″.0045″
    PTH Tolerance [+/-].003″.002″.0015″
    NPTH Tolerance.001″.001″.001″
    Back Drill Depth Tolerance.005″.003″.002″


    HDI CAPABILITIES
    		STANDARD
    		ADVANCED
    		DEVELOPMENT (NPI ONLY)
    Sequential Lamination3x Lam Cycles7x Lam Cycles8x Lam Cycles
    Laser Micro Vias.004″.003″.0025″
    Blind Aspect Ratio.75:11:11.2:1
    Blind/Buried Vias.005″.004″.003″
    Via in PadEpoxy or Copper Filled––
    Laser Routing Board Thickness<.040″.040″ – .062″.062″ +


    SOLDER MASK-NOMENCLATURE
    		STANDARD
    		ADVANCED
    		DEVELOPMENT (NPI ONLY)
     LPI SoldermaskGreen, Blue, Red, ClearBlack, White, PurpleAll Colors
    Minimum Clearance.002″.001″.0005″
    Minimum Web.004″.003″.002″
    Legend ColorWhiteBlack, Yellow, OrangeAll Colors


    TEST & MEASUREMENT
    		STANDARD
    		ADVANCED
    		DEVELOPMENT (NPI ONLY)
    Flying Probe TestYesYesYes
    Fixture TestYesYesYes
    TDRYesYesYes
    IonicsYesYesYes
    CMI XRFYesYesYes
    D CouponYesYesYes
    ISTYesYesYes
    HI-POTYesYesYes


    DOWNLOAD CORPORATE MANUFACTURING CAPABILITIES


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