Maximum Board Size
16x22
19x22
Maximum Panel Size
18 x 24
21x24, 20x26
N/A
Maximum Board Thickness
0.25
Minimum Board Thickness
0.01
0.008
Overall Board Thickness Tolerance (+/- %)
10%
7%
5%
Warpage/ Bow and Twist capability - mils per Inch
0.0100
0.0075
0.0050
Maximum Rigid Layer Count
28
42
42+
Maximum Rigid-Flex Layer Count
Minimum Core Thickness
0.002
0.001
0.0005
Minimum Dielectric Thickness
0.002
0.001
Lam Cycles Rigid
5x
7x
9X
Lam Cycles Rigid-Flex
N/A
N/A
Maximum Board Size
16x22
18x22
N/A
Maximum Panel Size
18x24
21x24
N/A
Maximum Board Thickness
0.125
0.25
N/A
Minimum Board Thickness
0.01
0.008
0.005
Overall Board Thickness Tolerance (+/- %)
10%
7%
5%
Warpage/ Bow and Twist capability - mils per Inch
0.0075
0.0060
0.0050
Maximum Rigid Layer Count
< 20
38
>40
Maximum Rigid-Flex Layer Count
Minimum Core Thickness
0.002
Minimum Dielectric Thickness
0.003
0.002
0.0015
Lam Cycles Rigid
4X
6X
>6
Lam Cycles Flex
N/A
N/A
N/A
Lam Cycles Rigid-Flex
N/A
N/A
N/A
Maximum Board Size
14x20
15x21
16x22
Maximum Panel Size
18x24
21x24
Maximum Board Thickness
0.19
0.20
˃.200
Minimum Board Thickness
0.01
0.008
≤.007
Overall Board Thickness Tolerance (+/- %)
10%
8%
6%
Warpage/ Bow and Twist capability - mils per Inch
0.0100
0.0075
0.0050
Maximum Rigid Layer Count
24
26-30
32+
Maximum Rigid-Flex Layer Count
Minimum Core Thickness
0.002
0.001
0.001 Flex
Minimum Dielectric Thickness
0.002
0.001
.001 Flex
Lam Cycles Rigid
3x
5x
8x
Lam Cycles Flex
N/A
N/A
N/A
Lam Cycles Rigid-Flex
N/A
N/A
N/A
Maximum Board Size
15x21
21x25
Maximum Panel Size
18x24
24x26
>24x26
Maximum Board Thickness
.250"
.320"
Minimum Board Thickness
0.002 flex
0.002 flex
0.002 flex
Overall Board Thickness Tolerance (+/- %)
10%
7%
5%
Warpage/ Bow and Twist capability - mils per Inch
0.0100
0.0075
0.0050
Maximum Rigid Layer Count
28
38
38+
Maximum Flex Layer Count
6
10
12+
Maximum Rigid-Flex Layer Count
14
24
30+
Minimum Core Thickness
.0005 Flex
.001 Flex
.0005 Flex
Minimum Dielectric Thickness
.0005 Flex
.001 Flex
.0005 Flex
Lam Cycles Rigid
3x
4x
>4
Lam Cycles Rigid-Flex
3x
4x
>4
Maximum Board Size
16 x 22
16 x 52, 22 x 28
Maximum Panel Size
18 x 24
18 x 54, 24 x 30
36 x 119 DS
Maximum Board Thickness
0.25
Minimum Board Thickness
.010 Rigid
.008 Rigid
.006 Rigid
Overall Board Thickness Tolerance (+/- %)
10%
7%
5%
Warpage/ Bow and Twist capability - mils per Inch
0.0100
0.0075
0.0050
Maximum Rigid Layer Count
26
40
40 +
Maximum Flex Layer Count
N/A
N/A
N/A
Maximum Rigid-Flex Layer Count
N/A
N/A
N/A
Minimum Core Thickness
0.004
0.002
0.0010
Minimum Dielectric Thickness
0.002
0.001
N/A
Lam Cycles Rigid
3x
6x
>6x
Lam Cycles Flex
N/A
N/A
N/A
Lam Cycles Rigid-Flex
N/A
N/A
N/A
Maximum Board Thickness
0.125
0.155
Minimum Board Thickness
0.031
0.01
Overall Board Thickness Tolerance (+/- %)
10%
Warpage/ Bow and Twist capability - mils per Inch
0.0100
0.0750
Maximum Rigid Layer Count
18
24
Maximum Rigid-Flex Layer Count
Minimum Core Thickness
0.003
Minimum Dielectric Thickness
0.003
Trace/Space - Base Copper Thickness
Inner Layer Width - 1/4 oz. Cu
0.0025
0.003
Inner Layer with - 1/2 oz Cu
0.0035
0.0025
0.002
Inner Layer Width - 1 oz. Cu
0.0045
0.0035
0.003
Inner Layer Width - 2 oz. Cu
0.006
0.0055
0.004
Inner Layer Width - 3 oz. Cu
0.008
0.0075
0.006
Inner Layer Width - 4 oz. Cu
0.01
0.009
N/A
Inner Layer Space - Trace to Trace - 1/2 oz. Cu
0.0035
0.0025
0.002
Inner Layer Space - Trace to Trace - 1 oz. Cu
0.0045
0.004
0.003
Inner Layer Space - Trace to Trace - 2 oz. Cu
0.006
0.0055
0.005
Inner Layer Space - Trace to Trace - 3 oz. Cu
0.008
0.0075
0.006
Inner Layer Space - Trace to Trace - 4 oz. Cu
0.01
0.009
N/A
Outer Layer Width - 1/4 & 3/8 oz. Cu. Base
0.003
0.002
0.0015
Outer Layer Width - 1/2 oz. Cu. Base
0.0045
0.003
0.0022
Outer Layer Width - 1 oz. Cu. Base
0.0055
0.004
0.003
Outer Layer Width - 2 oz. Cu. Base
0.007
0.0055
0.004
Outer Layer Width - 3 oz. Cu. Base
0.009
0.0075
0.006
Outer Layer Space - Trace to Trace - 1/4 & 3/8 oz. Cu. Base
0.003
0.002
0.0015
Outer Layer Space - Trace to Trace - 1/2 oz. Cu. Base
0.003
0.0025
0.0022
Outer Layer Space - Trace to Trace - 1 oz. Cu. Base
0.0055
0.004
0.003
Outer Layer Space - Trace to Trace - 2 oz. Cu. Base
0.007
0.0055
0.005
Outer Layer Space - Trace to Trace - 3 oz. Cu. Base
0.009
0.0075
0.006
Gold Body / Bi-Level Gold w/ 0.25oz foil
0.0035
0.003
Gold Body / Bi-Level Gold w/ 0.5oz foil
0.004
0.0035
Minimum Outer Layer Trace Widths for Boards With Filled and Plated Over Vias.
0.005
0.004
0.003
Minimum Outer Layer Spacing for Boards With Filled and Plated Over Vias.
0.006
0.005
0.004
Inner Layer Width - 1/4 oz. Cu
0.0025
0.002
0.0015
Inner Layer with - 1/2 oz Cu
0.003
0.0025
0.002
Inner Layer Width - 1 oz. Cu
0.004
0.0035
0.003
Inner Layer Width - 2 oz. Cu
0.006
0.0055
0.005
Inner Layer Width - 3 oz. Cu
0.008
0.0075
0.007
Inner Layer Width - 4 oz. Cu
0.01
0.009
Inner Layer Space - Trace to Trace - 1/2 oz. Cu
0.003
0.003
0.00275
Inner Layer Space - Trace to Trace - 1 oz. Cu
0.005
0.004
0.0035
Inner Layer Space - Trace to Trace - 2 oz. Cu
0.006
0.005
0.00475
Inner Layer Space - Trace to Trace - 3 oz. Cu
0.008
0.0075
0.007
Inner Layer Space - Trace to Trace - 4 oz. Cu
0.01
0.009
Outer Layer Width - 1/4 & 3/8 oz. Cu. Base
0.003
0.0025
0.002
Outer Layer Width - 1/2 oz. Cu. Base
0.0035
0.003
0.0025
Outer Layer Width - 1 oz. Cu. Base
0.005
0.004
0.003
Outer Layer Width - 2 oz. Cu. Base
0.007
0.006
0.0055
Outer Layer Width - 3 oz. Cu. Base
0.009
0.008
n/a
Outer Layer Space - Trace to Trace - 1/4 & 3/8 oz. Cu. Base
0.003
0.00275
0.0025
Outer Layer Space - Trace to Trace - 1/2 oz. Cu. Base
0.00375
0.0035
0.00325
Outer Layer Space - Trace to Trace - 1 oz. Cu. Base
0.006
0.0055
0.005
Outer Layer Space - Trace to Trace - 2 oz. Cu. Base
0.007
0.006
Outer Layer Space - Trace to Trace - 3 oz. Cu. Base
0.009
0.008
Gold Body / Bi-Level Gold w/ 0.25oz foil
0.004
0.0035
Gold Body / Bi-Level Gold w/ 0.5oz foil
0.0045
0.004
Minimum Outer Layer Trace Widths for Boards With Filled and Plated Over Vias.
0.005
0.004
0.003
Minimum Outer Layer Spacing for Boards With Filled and Plated Over Vias.
0.006
0.005
0.004
Inner Layer Width - 1/4 oz. Cu
0.0025
0.003
Inner Layer with - 1/2 oz Cu
0.0035
0.003
0.00275
Inner Layer Width - 1 oz. Cu
0.0045
0.0035
0.003
Inner Layer Width - 2 oz. Cu
0.006
0.0055
0.005
Inner Layer Width - 3 oz. Cu
0.008
0.0075
0.007
Inner Layer Width - 4 oz. Cu
0.01
0.009
0.0085
Inner Layer Space - Trace to Trace - 1/2 oz. Cu
0.0035
0.003
0.00275
Inner Layer Space - Trace to Trace - 1 oz. Cu
0.0045
0.004
0.0035
Inner Layer Space - Trace to Trace - 2 oz. Cu
0.006
0.0055
0.005
Inner Layer Space - Trace to Trace - 3 oz. Cu
0.008
0.0075
0.007
Inner Layer Space - Trace to Trace - 4 oz. Cu
0.01
0.009
0.008
Outer Layer Width - 1/4 & 3/8 oz. Cu. Base
0.0035
0.003
0.00275
Outer Layer Width - 1/2 oz. Cu. Base
0.0045
0.0035
0.003
Outer Layer Width - 1 oz. Cu. Base
0.0055
0.004
0.003
Outer Layer Width - 2 oz. Cu. Base
0.01
0.006
0.005
Outer Layer Width - 3 oz. Cu. Base
0.009
0.0075
0.007
Outer Layer Space - Trace to Trace - 1/4 & 3/8 oz. Cu. Base
0.0035
0.003
0.00275
Outer Layer Space - Trace to Trace - 1/2 oz. Cu. Base
0.004
0.0035
0.003
Outer Layer Space - Trace to Trace - 1 oz. Cu. Base
0.0055
0.0045
0.0035
Outer Layer Space - Trace to Trace - 2 oz. Cu. Base
0.007
0.0065
0.006
Outer Layer Space - Trace to Trace - 3 oz. Cu. Base
0.009
0.008
0.007
Gold Body / Bi-Level Gold w/ 0.25oz foil
Gold Body / Bi-Level Gold w/ 0.5oz foil
Minimum Outer Layer Trace Widths for Boards With Filled and Plated Over Vias.
0.005
0.004
0.0035
Minimum Outer Layer Spacing for Boards With Filled and Plated Over Vias.
0.006
0.005
0.0045
Inner Layer Width - 1/4 oz. Cu
0.0025
0.003
Inner Layer with - 1/2 oz Cu
0.0035
0.003
0.0025
Inner Layer Width - 1 oz. Cu
0.0045
0.0035
0.003
Inner Layer Width - 2 oz. Cu
0.006
0.0055
0.0045
Inner Layer Width - 3 oz. Cu
0.008
0.0075
0.006
Inner Layer Width - 4 oz. Cu
0.01
0.009
N/A
Inner Layer Space - Trace to Trace - 1/2 oz. Cu
0.0035
0.003
0.0025
Inner Layer Space - Trace to Trace - 1 oz. Cu
0.0045
0.0035
0.003
Inner Layer Space - Trace to Trace - 2 oz. Cu
0.006
0.0055
0.005
Inner Layer Space - Trace to Trace - 3 oz. Cu
0.008
0.0075
0.006
Inner Layer Space - Trace to Trace - 4 oz. Cu
0.01
0.009
N/A
Outer Layer Width - 1/4 & 3/8 oz. Cu. Base
0.003
0.0025
0.002
Outer Layer Width - 1/2 oz. Cu. Base
0.0045
0.003
0.0025
Outer Layer Width - 1 oz. Cu. Base
0.0055
0.004
0.003
Outer Layer Width - 2 oz. Cu. Base
0.007
0.0055
0.004
Outer Layer Width - 3 oz. Cu. Base
0.009
0.0075
0.006
Outer Layer Space - Trace to Trace - 1/4 & 3/8 oz. Cu. Base
0.003
0.0025
0.002
Outer Layer Space - Trace to Trace - 1/2 oz. Cu. Base
0.0035
0.003
0.0025
Outer Layer Space - Trace to Trace - 1 oz. Cu. Base
0.0055
0.004
0.003
Outer Layer Space - Trace to Trace - 2 oz. Cu. Base
0.007
0.0055
0.005
Outer Layer Space - Trace to Trace - 3 oz. Cu. Base
0.009
0.0075
0.006
Gold Body / Bi-Level Gold w/ 0.25oz foil
0.0035
0.003
Gold Body / Bi-Level Gold w/ 0.5oz foil
0.004
0.0035
Minimum Outer Layer Trace Widths for Boards With Filled and Plated Over Vias.
0.005
0.004
0.003
Minimum Outer Layer Spacing for Boards With Filled and Plated Over Vias.
.006
.005
.004
Inner Layer Width - 1/4 oz. Cu
Inner Layer with - 1/2 oz Cu
0.003
0.0025
-
Inner Layer Width - 1 oz. Cu
0.004
0.0035
Inner Layer Width - 2 oz. Cu
0.006
0.0055
-
Inner Layer Width - 3 oz. Cu
0.008
0.007
Inner Layer Width - 4 oz. Cu
0.01
0.009
Inner Layer Space - Trace to Trace - 1/2 oz. Cu
0.003
0.0025
Inner Layer Space - Trace to Trace - 1 oz. Cu
0.004
0.004
Inner Layer Space - Trace to Trace - 2 oz. Cu
0.007
0.006
Inner Layer Space - Trace to Trace - 3 oz. Cu
0.01
0.009
Inner Layer Space - Trace to Trace - 4 oz. Cu
0.013
0.012
Outer Layer Width - 1/4 & 3/8 oz. Cu. Base
0.003
0.0025
Outer Layer Width - 1/2 oz. Cu. Base
0.003
0.0025
Outer Layer Width - 1 oz. Cu. Base
0.004
0.004
Outer Layer Width - 2 oz. Cu. Base
0.005
0.005
Outer Layer Width - 3 oz. Cu. Base
0.008
0.008
Outer Layer Space - Trace to Trace - 1/4 & 3/8 oz. Cu. Base
0.003
0.0025
Outer Layer Space - Trace to Trace - 1/2 oz. Cu. Base
0.003
0.0025
Outer Layer Space - Trace to Trace - 1 oz. Cu. Base
0.005
0.004
Outer Layer Space - Trace to Trace - 2 oz. Cu. Base
0.007
0.006
Outer Layer Space - Trace to Trace - 3 oz. Cu. Base
0.008
0.007
Gold Body / Bi-Level Gold w/ 0.25oz foil
0.0035
0.003
Gold Body / Bi-Level Gold w/ 0.5oz foil
0.004
0.0035
Minimum Outer Layer Trace Widths for Boards With Filled and Plated Over Vias.
0.004
0.0035
Minimum Outer Layer Spacing for Boards With Filled and Plated Over Vias.
0.004
0.0035
Inner Layer Width - 1/4 oz. Cu
Inner Layer with - 1/2 oz Cu
0.003
Inner Layer Width - 1 oz. Cu
0.004
Inner Layer Width - 2 oz. Cu
0.005
Inner Layer Width - 3 oz. Cu
0.008
Inner Layer Width - 4 oz. Cu
0.012
0.01
Inner Layer Space - Trace to Trace - 1/2 oz. Cu
0.003
Inner Layer Space - Trace to Trace - 1 oz. Cu
0.004
Inner Layer Space - Trace to Trace - 2 oz. Cu
0.005
Inner Layer Space - Trace to Trace - 3 oz. Cu
0.008
Inner Layer Space - Trace to Trace - 4 oz. Cu
0.012
0.01
Outer Layer Width - 1/4 & 3/8 oz. Cu. Base
0.003
Outer Layer Width - 1/2 oz. Cu. Base
0.004
Outer Layer Width - 1 oz. Cu. Base
0.005
Outer Layer Width - 2 oz. Cu. Base
0.008
Outer Layer Width - 3 oz. Cu. Base
0.012
0.01
Outer Layer Space - Trace to Trace - 1/4 & 3/8 oz. Cu. Base
0.003
Outer Layer Space - Trace to Trace - 1/2 oz. Cu. Base
0.004
Outer Layer Space - Trace to Trace - 1 oz. Cu. Base
0.005
Outer Layer Space - Trace to Trace - 2 oz. Cu. Base
0.008
Outer Layer Space - Trace to Trace - 3 oz. Cu. Base
0.012
0.01
Gold Body / Bi-Level Gold w/ 0.25oz foil
Gold Body / Bi-Level Gold w/ 0.5oz foil
0.004
Minimum Outer Layer Trace Widths for Boards With Filled and Plated Over Vias.
0.005
0.003
Minimum Outer Layer Spacing for Boards With Filled and Plated Over Vias.
0.005
0.003
Etch Requirements
Minimum copper sliver between antipads
0.005
0.004
Etch Tolerance and factor 1/2 OZ Cu or less inner/outer NO VF
+/-.00075
+/-.0005
Etch Tolerance and factor 1/2 OZ Cu or less inner/outer w/ VF
+/-.0015
+/-.001
Etch Tolerance and factor 1 OZ Cu inner/outer NO VF
+/-.0015
+/-.001
Etch Tolerance and factor 2 OZ Cu inner/outer NO VF
+/-.002
+/-.0015
Etch Tolerance and factor 3 OZ Cu inner/outer NO VF
+/-.0025
+/-.002
Minimum copper sliver between antipads
0.005
0.005
Etch Tolerance and factor 1/2 OZ Cu or less inner/outer NO VF
20%
15%
10%
Etch Tolerance and factor 1/2 OZ Cu or less inner/outer w/ VF
20%
15%
10%
Etch Tolerance and factor 1 OZ Cu inner/outer NO VF
20%
15%
10%
Etch Tolerance and factor 2 OZ Cu inner/outer NO VF
20%
15%
10%
Etch Tolerance and factor 3 OZ Cu inner/outer NO VF
20%
15%
Minimum copper sliver between antipads
0.005
0.004
Etch Tolerance and factor 1/2 OZ Cu or less inner/outer NO VF
+/-.00075
+/-.0005
Etch Tolerance and factor 1/2 OZ Cu or less inner/outer w/ VF
+/-.0015
+/-.001
Etch Tolerance and factor 1 OZ Cu inner/outer NO VF
+/-.0015
+/-.001
Etch Tolerance and factor 2 OZ Cu inner/outer NO VF
+/-.002
+/-.0015
Etch Tolerance and factor 3 OZ Cu inner/outer NO VF
+/-.0025
+/-.002
Minimum copper sliver between antipads
0.005
0.004
Etch Tolerance and factor 1/2 OZ Cu or less inner/outer NO VF
+/-.00075
+/-.0005
Etch Tolerance and factor 1/2 OZ Cu or less inner/outer w/ VF
+/-.0015
+/-.001
Etch Tolerance and factor 1 OZ Cu inner/outer NO VF
+/-.0015
+/-.001
Etch Tolerance and factor 2 OZ Cu inner/outer NO VF
+/-.002
+/-.0015
Etch Tolerance and factor 3 OZ Cu inner/outer NO VF
+/-.0025
+/-.002
Minimum copper sliver between antipads
0.005
0.004
Etch Tolerance and factor 1/2 OZ Cu or less inner/outer NO VF
+/-.00075
+/-.0005
Etch Tolerance and factor 1/2 OZ Cu or less inner/outer w/ VF
+/-.001
+/-.001
Etch Tolerance and factor 1 OZ Cu inner/outer NO VF
+/-.002
+/-.0015
Etch Tolerance and factor 2 OZ Cu inner/outer NO VF
+/-.0025
+/-.002
Etch Tolerance and factor 3 OZ Cu inner/outer NO VF
+/-.003
+/-.003
Minimum copper sliver between antipads
0.005
0.004
Etch Tolerance and factor 1/2 OZ Cu or less inner/outer NO VF
+/-.002
+/-.001
Etch Tolerance and factor 1/2 OZ Cu or less inner/outer w/ VF
+/-.002
+/-.001
Etch Tolerance and factor 1 OZ Cu inner/outer NO VF
+/-.002
+/-.001
Etch Tolerance and factor 2 OZ Cu inner/outer NO VF
+/-.002
+/-.0016
Etch Tolerance and factor 3 OZ Cu inner/outer NO VF
+/-.003
+/-.0024
Drill & Rout
Smallest Mechanical PTH - Via (aspect ratio driven)
0.0059
0.005
Smallest PTH - Component
0.015
PTH - Tolerance
0.003
0.002
0.0015
PTH - Tolerance Press Fit
0.0025
0.002
0.0015
NPTH - Tolerance
0.002
0.001
NPTH - Slot Tolerance
+/-.004
+/- .003
+/-.002
PTH - Slot Tolerance
+/-.005
+/-.004
+/-.003
Standard Rout Tolerances
+/-.005
+/-.004
+/-.003
Optical Rout Tolerances (Rout edge to feature location)
+/-.003
+/-.002
+/-.0015
Aspect Ratio - Plated Through Holes - > .020" drilled
10:1
12:1
14:1
Aspect Ratio - Plated Through Holes - .010"-.019" drilled
10:1
12:1
14:1
Minimum Drill to Copper for PTH
0.01
0.008
0.006
Minimum Drill to Copper for PTH Sub Asemblies
0.008
0.006
0.005
Minimum Drill to Copper for Laser uVias
0.006
0.004
Minimum hole to hole edge for PTH
0.012
0.01
0.008
Minimum hole to hole edge for Laser uVias
0.008
0.005
Drill/Pad Size - No Break Out - Thru drill.
nominal +.015
nominal + .012
Drill/Pad Size - No Break Out - HDI
nominal +.006
nominal + .005
Minimum Pad
0.015
0.01
0.008
Minimum Isolated Pad
0.01
0.009
0.008
Minimum Laser Drilled pad
0.01
0.008
0.004
SMT Pitch
0.01
0.008
0.006
Buried Vias - Mechanical Drill Minimum Size
0.0059
0.005
0.004
Buried Vias - Mechanical Drill - Max Aspect Ratio
10:1
12:1
14:1
Blind Vias - Mechanical Drill Minimum
0.0059
0.005
Blind Vias - Mechanical Drill - Max Aspect Ratio
.7:1
.8:1
1:1
Blind Vias - Laser Drilled. - Minimum Size
0.004
0.003
0.002
Blind Vias - Laser Drilled. - Maximum Size
0.007
0.008
0.009
Blind Vias - Laser Drilled. - Maximum Aspect Ratio.
.7:1
.8:1
1:01
Maximum Copper Fill Depth Micro uVias
0.004
0.005
0.006
Back Drill Depth Remaning Stub
0.01
0.008
0.006
Back Drill - Minimum Over Primary Drill Size (Oversize bit will depend on primary drill size)
+.012-.007
Back Drill - Depth Tolerance
+/-.005
+/-.003
+/-.002
Min Back Drill Depth for filled & plated over BD holes
0.01
0.006
Drill True Position Tolerance Standard (+/-)
0.005
0.004
0.003
Drill True Position Tolerance w/ camera alignment (+/-)
0.003
0.002
0.001
Drill hole to hole positional tolerance (+/-)
0.003
0.002
Minimum PTH Size That Can Be Filled With Non Conductive Material and Plated Over
0.0079
0.0059
0.005
Maximum PTH Size That Can Be Filled With Non Conductive Material and Plated Over
0.018
0.02
Smallest PTH - Via HDI
0.006
0.004
0.003
Smallest Mechanical PTH - Via (aspect ratio driven)
0.0059
0.0051
0.004
Smallest PTH - Component
0.018
0.012
PTH - Tolerance
+/-.003
+/-.002
+/-.0015
PTH - Tolerance Press Fit
+/-.002
+/-.002
+/-.0015
NPTH - Tolerance
+/-.002
+/-.001
NPTH - Slot Tolerance
+/-.003
+/-.002
+/-.0015
PTH - Slot Tolerance
+/-.004
+/-.003
+/-.002
Standard Rout Tolerances
+/-.005
+/-.004
+/-.003
Optical Rout Tolerances (Rout edge to feature location)
+/-.003
+/-.002
+/-.0015
Aspect Ratio - Plated Through Holes - > .020" drilled
10:1
12.5:1
Aspect Ratio - Plated Through Holes - .010"-.019" drilled
10:1
12.5:1
14:1
Minimum Drill to Copper for PTH
0.008
0.007
0.006
Minimum Drill to Copper for PTH Sub Asemblies
0.008
0.007
0.006
Minimum Drill to Copper for Laser uVias
0.005
0.004
0.0035
Minimum hole to hole edge for PTH
0.015
0.008
0.007
Minimum hole to hole edge for Laser uVias
0.005
0.004
0.0035
Drill/Pad Size - No Break Out - Thru drill.
nominal +.012
nominal + .010
nominal + .008
Drill/Pad Size - No Break Out - HDI
nominal +.006
nominal + .005
nominal + .004
Minimum Pad
0.012
0.01
N/A
Minimum Isolated Pad
0.015
0.01
0.008
Minimum Laser Drilled pad
0.01
0.008
0.006
SMT Pitch
0.01
0.008
0.006
Buried Vias - Mechanical Drill Minimum Size
0.0059
0.0051
0.004
Buried Vias - Mechanical Drill - Max Aspect Ratio
12:1
13:1
15:1
Blind Vias - Mechanical Drill Minimum
0.0059
0.0051
0.004
Blind Vias - Mechanical Drill - Max Aspect Ratio
.7:1
.8:1
1:1
Blind Vias - Laser Drilled. - Minimum Size
0.004
0.003
0.002
Blind Vias - Laser Drilled. - Maximum Size
0.01
0.012
N/A
Blind Vias - Laser Drilled. - Maximum Aspect Ratio.
10:1
12:1
N/A
Maximum Copper Fill Depth Micro uVias
0.006
0.008
0.01
Back Drill Depth Remaning Stub
0.01
0.008
0.006
Back Drill - Minimum Over Primary Drill Size (Oversize bit will depend on primary drill size)
0.012
0.01
0.008
Back Drill - Depth Tolerance
+/-.005
+/-.003
+/-.002
Min Back Drill Depth for filled & plated over BD holes
0.01
0.006
Drill True Position Tolerance Standard (+/-)
0.005
0.003
Drill True Position Tolerance w/ camera alignment (+/-)
0.003
0.002
0.001
Drill hole to hole positional tolerance (+/-)
0.003
0.0025
0.002
Minimum PTH Size That Can Be Filled With Non Conductive Material and Plated Over
0.006
0.005
Maximum PTH Size That Can Be Filled With Non Conductive Material and Plated Over
0.018
0.025
0.03
Smallest PTH - Via HDI
0.006
0.005
≤.004
Smallest Mechanical PTH - Via (aspect ratio driven)
0.0059
0.005
Smallest PTH - Component
0.015
PTH - Tolerance
0.003
0.002
0.0015
PTH - Tolerance Press Fit
0.0025
0.002
0.0015
NPTH - Tolerance
0.002
0.001
NPTH - Slot Tolerance
+/-.004
+/- .003
+/-.002
PTH - Slot Tolerance
+/-.005
+/-.004
+/-.003
Standard Rout Tolerances
+/-.005
+/-.004
+/-.003
Optical Rout Tolerances (Rout edge to feature location)
0.004
0.003
Aspect Ratio - Plated Through Holes - > .020" drilled
10:1
13:1
16:1
Aspect Ratio - Plated Through Holes - .010"-.019" drilled
10:1
13:1
16:1
Minimum Drill to Copper for PTH
0.01
0.008
0.007
Minimum Drill to Copper for PTH Sub Asemblies
0.008
0.007
Minimum Drill to Copper for Laser uVias
0.006
0.0025
0.002
Minimum hole to hole edge for PTH
0.012
0.01
0.008
Minimum hole to hole edge for Laser uVias
0.008
0.005
≤.005
Drill/Pad Size - No Break Out - Thru drill.
nominal +.014
nominal + .012
Drill/Pad Size - No Break Out - HDI
nominal +.006
nominal + .005
Minimum Pad
0.01
0.008
0.008
Minimum Isolated Pad
0.012
0.01
0.008
Minimum Laser Drilled pad
0.012
0.01
0.008
Buried Vias - Mechanical Drill Minimum Size
0.0079
0.0059
Buried Vias - Mechanical Drill - Max Aspect Ratio
10:1
12:1
14:1
Blind Vias - Mechanical Drill Minimum
0.0079
0.0059
Blind Vias - Mechanical Drill - Max Aspect Ratio
10:01
12:01
14:01
Blind Vias - Laser Drilled. - Minimum Size
0.006
0.0055
Blind Vias - Laser Drilled. - Maximum Size
0.007
0.008
0.009
Blind Vias - Laser Drilled. - Maximum Aspect Ratio.
.5:1
0.75:1
.85:1
Maximum Copper Fill Depth Micro uVias
0.003
0.004
0.006
Back Drill Depth Remaning Stub
0.01
0.008
0.006
Back Drill - Minimum Over Primary Drill Size (Oversize bit will depend on primary drill size)
0.01
0.009
0.008
Back Drill - Depth Tolerance
+/-.005
+/-.003
+/-.002
Min Back Drill Depth for filled & plated over BD holes
0.01
0.009
Drill True Position Tolerance Standard (+/-)
0.003
0.002
Drill True Position Tolerance w/ camera alignment (+/-)
0.002
0.0018
Drill hole to hole positional tolerance (+/-)
0.003
0.002
Minimum PTH Size That Can Be Filled With Non Conductive Material and Plated Over
0.0098
0.0079
Maximum PTH Size That Can Be Filled With Non Conductive Material and Plated Over
0.035
0.04
Smallest Mechanical PTH - Via (aspect ratio driven)
0.0059
0.005
Smallest PTH - Component
0.015
0.012
PTH - Tolerance
+/-.003
+/-.002
+/-.0015
PTH - Tolerance Press Fit
+/-.0025
+/-.002
+/-.0015
NPTH - Tolerance
+/-.002
+/-.001
Standard Rout Tolerances
+/-.005
+/-.004
+/-.003
Optical Rout Tolerances (Rout edge to feature location)
+/-.003
+/-.002
+/-.0015
Aspect Ratio - Plated Through Holes - > .020" drilled
10:1
12:1
14:1
Aspect Ratio - Plated Through Holes - .010"-.019" drilled
10:1
12:1
14:1
Minimum Drill to Copper for PTH
0.01
0.008
0.006
Minimum Drill to Copper for PTH Sub Asemblies
0.01
0.008
0.006
Minimum Drill to Copper for Laser uVias
0.006
0.005
Minimum hole to hole edge for PTH
0.012
0.01
0.008
Minimum hole to hole edge for Laser uVias
0.008
0.006
Drill/Pad Size - No Break Out - Thru drill.
nominal +.017
nominal + .015
Drill/Pad Size - No Break Out - HDI
nominal +.006
nomina + .005
Minimum Pad
0.015
0.01
0.008
Minimum Isolated Pad
0.015
0.01
0.008
Minimum Laser Drilled pad
0.012
0.01
0.008
SMT Pitch
0.01
0.008
0.006
Buried Vias - Mechanical Drill Minimum Size
0.008
0.006
0.004
Buried Vias - Mechanical Drill - Max Aspect Ratio
10:1
12:1
14:1
Blind Vias - Mechanical Drill Minimum
0.008
0.006
0.004
Blind Vias - Mechanical Drill - Max Aspect Ratio
10:1
12:1
14:1
Blind Vias - Laser Drilled. - Minimum Size
0.004
0.003
0.002
Blind Vias - Laser Drilled. - Maximum Size
0.007
0.008
0.009
Blind Vias - Laser Drilled. - Maximum Aspect Ratio.
0.5:1
0.75:1
1:1
Maximum Copper Fill Depth Micro uVias
0.004
0.005
0.006
Back Drill Depth Remaning Stub
0.01
0.008
0.006
Back Drill - Minimum Over Primary Drill Size (Oversize bit will depend on primary drill size)
0.012
0.01
0.008
Back Drill - Depth Tolerance
+/-.005
+/-.003
+/-.002
Min Back Drill Depth for filled & plated over BD holes
0.01
0.008
Drill True Position Tolerance Standard (+/-)
0.006
0.005
0.004
Drill True Position Tolerance w/ camera alignment (+/-)
0.003
0.002
0.001
Drill hole to hole positional tolerance (+/-)
0.003
0.0025
0.002
Minimum PTH Size That Can Be Filled With Non Conductive Material and Plated Over
0.0091
0.0078
Maximum PTH Size That Can Be Filled With Non Conductive Material and Plated Over
0.025
0.028
.0.038
Smallest Mechanical PTH - Via (aspect ratio driven)
0.0043
Smallest PTH - Component
0.015
PTH - Tolerance
0.003
0.002
PTH - Tolerance Press Fit
0.002
0.002
NPTH - Tolerance
0.002
0.002
NPTH - Slot Tolerance
+/-.004
+/-.004
PTH - Slot Tolerance
+/-.005
+/-.004
Standard Rout Tolerances
+/-.005
+/-.004
Optical Rout Tolerances (Rout edge to feature location)
-
-
Aspect Ratio - Plated Through Holes - > .020" drilled
10:1
12:1
Aspect Ratio - Plated Through Holes - .010"-.019" drilled
10:1
12:1
Minimum Drill to Copper for PTH
0.007
0.006
Minimum Drill to Copper for PTH Sub Asemblies
0.007
0.006
Minimum Drill to Copper for Laser uVias
0.004
0.004
Minimum hole to hole edge for PTH
0.01
0.008
Minimum hole to hole edge for Laser uVias
0.006
0.004
Drill/Pad Size - No Break Out - Thru drill.
nominal +.012
nominal + .010
Drill/Pad Size - No Break Out - HDI
nominal +.006
nominal + .005
Minimum Isolated Pad
0.012
0.01
Minimum Laser Drilled pad
0.01
0.008
Buried Vias - Mechanical Drill Minimum Size
0.0059
0.005
Buried Vias - Mechanical Drill - Max Aspect Ratio
10:1
12:1
Blind Vias - Mechanical Drill Minimum
0.0059
0.0059
Blind Vias - Mechanical Drill - Max Aspect Ratio
.7:1
.8:1
Blind Vias - Laser Drilled. - Minimum Size
0.004
0.003
Blind Vias - Laser Drilled. - Maximum Size
0.008
0.007
Blind Vias - Laser Drilled. - Maximum Aspect Ratio.
.75:1
1:01
Maximum Copper Fill Depth Micro uVias
0.006
0.005
Back Drill Depth Remaning Stub
0.008
0.005
Back Drill - Minimum Over Primary Drill Size (Oversize bit will depend on primary drill size)
0.01
0.008
Back Drill - Depth Tolerance
0.005
0.003
Min Back Drill Depth for filled & plated over BD holes
0.01
0.006
Drill True Position Tolerance Standard (+/-)
0.004
0.003
Drill True Position Tolerance w/ camera alignment (+/-)
-
-
Drill hole to hole positional tolerance (+/-)
0.003
0.002
Minimum PTH Size That Can Be Filled With Non Conductive Material and Plated Over
0.0059
0.0059
Maximum PTH Size That Can Be Filled With Non Conductive Material and Plated Over
0.04
0.03
Smallest Mechanical PTH - Via (aspect ratio driven)
0.006
0.004
Smallest PTH - Component
0.015
PTH - Tolerance
0.003
0.002
PTH - Tolerance Press Fit
0.003
0.002
NPTH - Tolerance
0.002
0.002
NPTH - Slot Tolerance
+/-0.005
+/-0.003
PTH - Slot Tolerance
+/-0.005
+/-0.003
Standard Rout Tolerances
+/-0.005
+/-0.003
Optical Rout Tolerances (Rout edge to feature location)
Aspect Ratio - Plated Through Holes - > .020" drilled
10:1
Aspect Ratio - Plated Through Holes - .010"-.019" drilled
10:1
Minimum Drill to Copper for PTH
0.01
0.008
Minimum Drill to Copper for PTH Sub Asemblies
Minimum Drill to Copper for Laser uVias
Minimum hole to hole edge for PTH
0.01
Minimum hole to hole edge for Laser uVias
Drill/Pad Size - No Break Out - Thru drill.
nominal + .01
Drill/Pad Size - No Break Out - HDI
Minimum Laser Drilled pad
Buried Vias - Mechanical Drill Minimum Size
Buried Vias - Mechanical Drill - Max Aspect Ratio
Blind Vias - Mechanical Drill Minimum
Blind Vias - Mechanical Drill - Max Aspect Ratio
Blind Vias - Laser Drilled. - Minimum Size
Blind Vias - Laser Drilled. - Maximum Size
Blind Vias - Laser Drilled. - Maximum Aspect Ratio.
Maximum Copper Fill Depth Micro uVias
Back Drill Depth Remaning Stub
Back Drill - Minimum Over Primary Drill Size (Oversize bit will depend on primary drill size)
Back Drill - Depth Tolerance
Min Back Drill Depth for filled & plated over BD holes
Drill True Position Tolerance Standard (+/-)
0.005
0.004
Drill True Position Tolerance w/ camera alignment (+/-)
Drill hole to hole positional tolerance (+/-)
0.003
0.002
Minimum PTH Size That Can Be Filled With Non Conductive Material and Plated Over
0.008
.004 or 10:1 aspect ratio
Maximum PTH Size That Can Be Filled With Non Conductive Material and Plated Over
0.018
2:1 aspect ratio
Impedance
Impedance - Tolerance
+/-10%
+/-5%
<+/-5%
Maximum Impedance - Value Ohms
110Ω
150Ω
Minimum Impedance - Value Ohms
28Ω
25Ω
Impedance Coupon Size
.5"x 6"
custom
Impedance - Tolerance
+/-10%
+/-7%
+/-5%
Maximum Impedance - Value Ohms
100Ω
130Ω
Minimum Impedance - Value Ohms
28Ω
25Ω
Impedance Coupon Size
7" X .500"
.5"x 6"
custom
Impedance - Tolerance
+/-10%
+/-8%
+/-5%
Maximum Impedance - Value Ohms
100Ω
110Ω
Minimum Impedance - Value Ohms
50Ω
40Ω
Impedance Coupon Size
.5"x 6"
custom
Impedance - Tolerance
+/-10%
+/-7%
+/-5%
Maximum Impedance - Value Ohms
100Ω
130Ω
Minimum Impedance - Value Ohms
28Ω
25Ω
Impedance Coupon Size
.5"x 6"
custom
Impedance - Tolerance
+/-10%
+/-7%
+/-5%
Maximum Impedance - Value Ohms
110Ω
150Ω
Minimum Impedance - Value Ohms
35Ω
25Ω
Impedance Coupon Size
.5"x 6"
custom
Impedance - Tolerance
+/-10%
+/-5%
Maximum Impedance - Value Ohms
120Ω
Minimum Impedance - Value Ohms
35Ω
Impedance Coupon Size
8"x1" (varies)
Solder Mask & Silkscreen
Solder Mask Web width over laminate (i.e. between pads)
0.004
0.003
0.002
Solder Mask Web width over copper (i.e. over a trace)
0.003
0.002
0.002
Solder Mask Clearance to Pad(i.e. annular ring)
0.003
0.002
0.001
Minimum Silkscreen line width / height (white only)
4 mils / 15-20 mils
3 mils /15-20 mils
Standard Silkscreen line width / height
5 mils / 25-30 mils
N/A
Maximum Tented Via
0.016
0.02
Solder Mask Web width over laminate (i.e. between pads)
0.0035
0.003
n/a
Solder Mask Web width over copper (i.e. over a trace)
0.0035
0.003
Solder Mask Clearance to Pad(i.e. annular ring)
0.003
0.002
0.001
Minimum Silkscreen line width / height (white only)
0.004
0.003
Standard Silkscreen line width / height
.004 / .020
.003 / .025
Maximum Tented Via
0.014
0.016
0.018
Solder Mask Web width over laminate (i.e. between pads)
0.004
0.0035
0.003
Solder Mask Web width over copper (i.e. over a trace)
0.004
0.0035
0.003
Solder Mask Clearance to Pad(i.e. annular ring)
0.003
0.002
0.0015
Minimum Silkscreen line width / height (white only)
4 mils / 15-20 mils
3 mils /15-20 mils
N/A
Standard Silkscreen line width / height
5 mils / 25-30 mils
Maximum Tented Via
0.016
0.02
Solder Mask Web width over laminate (i.e. between pads)
0.004
0.003
0.002
Solder Mask Web width over copper (i.e. over a trace)
0.003
0.002
0.002
Solder Mask Clearance to Pad(i.e. annular ring)
0.003
0.002
0.001
Minimum Silkscreen line width / height (white only)
4 mils / 15-20 mils
3 mils /15-20 mils
Standard Silkscreen line width / height
5 mils / 25-30 mils
N/A
Maximum Tented Via
0.016
0.02
Solder Mask Web width over laminate (i.e. between pads)
0.004
0.004
Solder Mask Web width over copper (i.e. over a trace)
0.004
0.004
Solder Mask Clearance to Pad(i.e. annular ring)
0.004
0.003
Minimum Silkscreen line width / height (white only)
3.5 mils / 15-20 mils
3 mils /15-20 mils
Standard Silkscreen line width / height
6 mils / 25-30 mils
Maximum Tented Via
0.016
0.02
Solder Mask Web width over laminate (i.e. between pads)
0.004
0.003
Solder Mask Web width over copper (i.e. over a trace)
0.004
0.003
Solder Mask Clearance to Pad(i.e. annular ring)
0.002
Minimum Silkscreen line width / height (white only)
0.005
0.003
Standard Silkscreen line width / height
0.005
Spacing & Registration
Minimum Copper spacing To Board Edge
0.01
0.008
0.005
Minimum hole spacing To Board Edge
0.01
0.008
0.005
Layer to Layer Registration - Different Cores
0.003
0.002
Outer layer feature True Position Tolerance
0.006
0.005
0.003
Front to Back Registration (Same Core)
.001"
.0005"
HASL Pad to Pad Space & Pad Size (Ganged areas not doable for SC)
.008'/.020"
Minimum Copper spacing To Board Edge
0.01
0.008
0.005
Minimum hole spacing To Board Edge
0.01
0.008
0.005
Layer to Layer Registration - Different Cores
0.003
0.002
Outer layer feature True Position Tolerance
+/-.005
+/-.003
+/.002
Front to Back Registration (Same Core)
0.001"
0.001"
0.0005"
HASL Pad to Pad Space & Pad Size (Ganged areas not doable for SC)
0.006
0.005
0.004
Minimum Copper spacing To Board Edge
0.01
0.008
0.005
Minimum hole spacing To Board Edge
0.01
0.008
0.005
Layer to Layer Registration - Different Cores
.003
0.002
Outer layer feature True Position Tolerance
20%
15%
Front to Back Registration (Same Core)
0.002
0.0015
HASL Pad to Pad Space & Pad Size (Ganged areas not doable for SC)
0.006
0.005
Minimum Copper spacing To Board Edge
.010
.008
.005
Minimum hole spacing To Board Edge
.010
.008
.005
Layer to Layer Registration - Different Cores
0.005
0.004
0.003
Outer layer feature True Position Tolerance
0.006
0.005
0.004
Front to Back Registration (Same Core)
.001"
0.0005"
HASL Pad to Pad Space & Pad Size (Ganged areas not doable for SC)
Minimum Copper spacing To Board Edge
0.01
0.008
0.005
Minimum hole spacing To Board Edge
0.01
0.008
0.005
Layer to Layer Registration - Different Cores
0.003
0.002
Outer layer feature True Position Tolerance
.001"
.0005"
Front to Back Registration (Same Core)
0.006
0.005
0.003
HASL Pad to Pad Space & Pad Size (Ganged areas not doable for SC)
Minimum Copper spacing To Board Edge
0.01
Minimum hole spacing To Board Edge
0.01
Layer to Layer Registration - Different Cores
-
0.003
Outer layer feature True Position Tolerance
0.001
Front to Back Registration (Same Core)
0.006
0.005
HASL Pad to Pad Space & Pad Size (Ganged areas not doable for SC)
